<![CDATA[苏州赛森电子U技有限公司Suzhou Cycas Electronic Technology Co]]> zh_CN 2020-06-16 14:51:59 2020-06-16 14:51:59 YBlog RSS Generator 5 <![CDATA[KDF943i]]> <![CDATA[ECLIPSE1]]> <![CDATA[Des-212 drum type degumming machine]]> <![CDATA[P5000CVD]]> <![CDATA[NovellusC1ND-109]]> <![CDATA[NovellusC1ND-103]]> <![CDATA[Aviza/Spts]]> <![CDATA[MRC PVD(自己仓库QMRC PVD (own warehouse)]]> <![CDATA[MRC PVD(合肥QMRC PVD (own warehouse)]]> <![CDATA[MRC PVDQ贵州)MRC PVD(own warehouse)]]> <![CDATA[Axcelis 8250 medium current implanter]]> <![CDATA[Nissin Exceed 3000AH medium current implanter]]> <![CDATA[EVG6200 mask aligner]]> <![CDATA[Suss Gemma Developer Cluster System]]> <![CDATA[Nexus350i]]> <![CDATA[Gasonics PEP3510 resist asher]]> <![CDATA[EVG Gemini Automated production Wafer Bond]]> <![CDATA[FEI865 dual beam]]> <![CDATA[VeecoRF350]]> <![CDATA[TEL Alpha8S diffusion furnace]]> <![CDATA[Suss FC150 Flip Chip bonder]]> <![CDATA[Suss ACS300+ coater/developer]]> <![CDATA[Gasonics PEP3510 resist asher]]> <![CDATA[CHA Mark40 Evaporator]]> <![CDATA[Gasonics L3510]]> <![CDATA[Lam TCP 9600]]> <![CDATA[P5000]]> <![CDATA[P5000]]> <![CDATA[{离子体表面处理的技术及应用Technology and application of plasma surface treatment]]> <![CDATA[{离子体表面处理的原理Principle of plasma surface treatment]]> <![CDATA[A complete set of equipment for surface modification, surface activation, etching and nano coating of plasma cleaning machine{离子体清洗面改性、表面活化、刻蚀、纳cx层一台设备全搞定 A complete set of equipment for surface modification, surface activation, etching and nano coating]]> <![CDATA[怎么选等d清洗备厂商呢QHow to choose plasma cleaning equipment manufacturers?]]> <![CDATA[{离子清z机效果如何评估   How to evaluate the effect of plasma cleaning machine?]]> <![CDATA[ A complete set of equipment for surface modification, surface activation, etching and nano coating of plasma cleaning machine{离子体清洗面改性、表面活化、刻蚀、纳cx层一台设备全搞定]]> <![CDATA[{离子清z机在手业中的应用Application of plasma cleaning machine in mobile phone industry]]> <![CDATA[{离子表面处理技术在塑料行业的应用Application of plasma surface treatment technology in plastics industry]]> <![CDATA[控溅射的工作原理Working principle of magnetron sputtering]]> <![CDATA[Magnetron sputtering has two characteristics of "low temperature" and "high speed"控溅射h“低温”、“高速”两大特点Magnetron sputtering has two characteristics of]]> <![CDATA[What are balanced magnetron sputtering and unbalanced magnetron sputtering?什么是q控溅射和非q控溅射Q]]> <![CDATA[{离子刻蚀机的验操作及处理模式    Inspection operation and treatment mode of plasma etcher]]> <![CDATA[{离子综合性技术有哪些Q?What are the comprehensive plasma technologies?]]> <![CDATA[{离子刻蚀技? Plasma etching technology]]> <![CDATA[Application of plasma cleaning machine in semiconductor etching process{离子清z机在半g刻蚀工艺中的应用]]> <![CDATA[微L{离子干法去胶机影响因素QInfluencing factors of microwave plasma dry degumming machine:]]> <![CDATA[控溅射各有不同工作原理和应用对象Magnetron sputtering has different working principles and application objects]]> <![CDATA[选择真空退火炉需要考虑的因素 Factors to be considered in selecting vacuum annealing furnace]]> <![CDATA[The third industrial transfer of semiconductors, Chinas decisive victory in the "battle of tianwangshan"半导体第三次产业转移Q中国决?“天王山之战”]]> <![CDATA[Sputtering is to bombard the target surface with charged particles in vacuum溅射镀膜就是在真空中利用荷能粒子蘪击靶表面]]> <![CDATA[控溅射讑֤的主要用途Main uses of magnetron sputtering equipment]]> <![CDATA[微L{离子去胶机操作规程 Operation procedures of microwave plasma degummer:]]> <![CDATA[真空退火炉工艺布置及高温密圈概况Process layout and high temperature sealing ring of vacuum annealing furnace]]> <![CDATA[In the plasma degumming machine, what is the main gas that plays a degumming role?在等d去胶Z主要起到去胶作用的气体是什么?]]> <![CDATA[控溅射U类QMagnetron sputtering type?]]> <![CDATA[{离子干法去胶机反应机理QReaction mechanism of plasma dry degumming machine:]]> <![CDATA[PVD沉积方式的比较Comparison of PVD deposition methods]]> <![CDATA[Study on the properties of aluminum plating by electron beam evaporation and magnetron sputtering电子束蒸发与控溅射镀铝性能分析研究]]> <![CDATA[Principle and solution of medium frequency magnetron sputtering coating technology中频控溅射镀膜技术的原理及问题解{]]> <![CDATA[蚀L腐蚀加工蚀ȝ片的工艺程Process flow of etching mesh by etching machine]]> <![CDATA[金属化学蚀L的步骤Steps of metal chemical etching machine]]> <![CDATA[金属标牌腐蚀机的蚀L蚀dZlIntroduction to etching process of etching solution of metal plate etching machine]]> <![CDATA[教您如何为金属蚀L调配油墨QTeach you how to mix ink for metal etching machine!]]> <![CDATA[蚀L喷头的作用及l护Function and maintenance of etcher nozzle]]> <![CDATA[金属化学蚀L的步骤Steps of metal chemical etching machine]]> <![CDATA[Why cant the development of etching machine always show through?蚀L腐蚀技术之Z么有时显影L不透?]]> <![CDATA[快速退火炉l修注意事项QPrecautions for maintenance of rapid annealing furnaceQ]]> <![CDATA[Whats the difference between metal etching and manual etching?蚀L用途金属腐蚀和h工腐蚀加工的区别?]]> <![CDATA[带RIE{离子刻蚀机处理模式介lThe introduction of processing mode of plasma etching machine with RIE]]> <![CDATA[微L{离子去胶机工作原理及应用Working principle and application of microwave plasma degummer]]> <![CDATA[金属腐蚀ZȀ光蚀L的区别The difference between metal etching machine and laser etching machine]]> <![CDATA[金属化学蚀L的发展简史Brief history of the development of metal chemical etching machine]]> <![CDATA[蚀L喷头的作用及l护Function and maintenance of etcher nozzle]]> <![CDATA[钛合金的蚀L加工工艺Etching machining technology of titanium alloy]]> <![CDATA[蚀L喷头的作用及l护Function and maintenance of etcher nozzle]]> <![CDATA[Why cant sputter coating completely replace thermal evaporation coating?溅射镀膜ؓ什么不能完全取代热蒸发镀膜?]]> <![CDATA[蚀L腐蚀前处理工解A detailed explanation of the pretreatment process of etching machine]]> <![CDATA[Factors affecting the degreasing of alkaline solution before etching the label of etching machine蚀L蚀L牌之前媄响碱液除油的的因素]]> <![CDATA[快速退火炉的维修注意事Precautions for maintenance of rapid annealing furnace]]> <![CDATA[Application of plasma treatment machine in surface modification of materials{离子处理机在材料表面改性中的应用]]> <![CDATA[{离子体q法去胶工艺原理及用Principle and application of plasma dry degumming machine ]]> <![CDATA[不锈钢装饰蚀L术?Stainless steel decorative etching technology?]]> <![CDATA[CCTV: Chinas micro and medium enterprises officially announced to master the 5nm etching machine technology!央视 : 中国中微正式宣布掌握5nm刻蚀机技?]]> <![CDATA[Precautions for use and routine maintenance of c406 magnetron sputtering equipmentC406控溅射讑֤使用及日怿L意事]]> <![CDATA[High density plasma etching is a key step in VLSI manufacturing高密度等d体刻蚀是当今超大规模集成电路制造过E中的关键步骤]]> <![CDATA[如何操作微L{离子去胶机QHow to operate microwave plasma degummer?]]> <![CDATA[型{离子去胶机在工作时的表现Performance of small plasma degummer in operation]]> <![CDATA[{离子刻蚀机的~点QDisadvantages of plasma etcher?]]> <![CDATA[快速退火炉l修注意事项QPrecautions for maintenance of rapid annealing furnaceQ]]> <![CDATA[Study on the properties of aluminum plating by electron beam evaporation and magnetron sputtering电子束蒸发与控溅射镀铝的性能分析研究]]> <![CDATA[带RIE{离子刻蚀机处理模式介lThe introduction of processing mode of plasma etching machine with RIE]]> <![CDATA[Chinas etching machine has successfully killed Japan and South Korea, and its high-end manufacturing goes to the world, with the technology reaching one thousandth of the hair中国刻蚀机成功秒杀日韩Q高端制造走向世界,工艺辑֏丝万分之一]]> <![CDATA[Chinas plasma etching machine has reached the advanced level in the world中国{离子体刻蚀C界先q水q]]> <![CDATA[型{离子去胶机在工作时的表现Performance of small plasma degummer in operation]]> <![CDATA[蚀L腐蚀加工蚀ȝ片的工艺程Process flow of etching mesh by etching machine]]> <![CDATA[2018 China semiconductor material and equipment industry development conference held2018中国半导体材料及讑֤产业发展大会举行]]> <![CDATA[Etching is one of the key technologies to determine the feature size刻蚀是决定特征尺寸的核心工艺技术之一]]> <![CDATA[微L{离子去胶机操作规程 Operation procedures of microwave plasma degummer:]]> <![CDATA[感应耦合{离子体刻蚀机结构Structure of inductively coupled plasma etcher]]> <![CDATA[Reactive ion etching machine is an independent RIE reactive ion etching system反应d刻蚀机是一Ƅ立式RIE反应d刻蚀pȝ]]> <![CDATA[Microwave plasma dry degumming machine operation and personnel微L{离子干法去胶机操作及配合h员防护:]]> <![CDATA[What is the working principle of the plasma etcher in the solar cell制作太阳能电池中的等d刻蚀机的工作原理是怎么L]]> <![CDATA[{离子刻蚀机的典型应用包括哪些QWhat are the typical applications of plasma etcher?]]> <![CDATA[什么公怼用到{离子刻蚀机What company will use plasma etching machine]]> <![CDATA[Measurement and control of plasma etching in plasma etcher{离子刻蚀机的{离子刻蚀的测量与控制]]> <![CDATA[What is intermediate frequency magnetron sputtering?]]> <![CDATA[赛森电子U技是做什么的QWhat does saisen electronic technology do?]]> <![CDATA[刻蚀的具体过E可描述几个步骤QHow many steps can be described in the etching process?]]> <![CDATA[{离子刻蚀机通常有几UŞ式?How many kinds of plasma etchers are there?]]> <![CDATA[Technical characteristics of rie-pe etcher and some data analysisRIE-PE刻蚀机技术性的特点以及一些资料分析]]> <![CDATA[全自动磁控溅系l技术分cTechnical classification of fully automatic magnetron sputtering system]]> <![CDATA[Is plasma etching (dry etching) and plasma cleaning one thing{离子蚀LQ干刻)与等d清洗机是一件事吗]]> <![CDATA[刻蚀的具体过E可描述为如下六个步骤The specific etching process can be described as the following six steps]]> <![CDATA[{离子刻蚀机的应用Application of plasma etcher]]> <![CDATA[反应d刻蚀机检验操作及判断Inspection operation and judgment of reactive ion etching machine]]> <![CDATA[如何操作微L{离子去胶机QHow to operate microwave plasma degummer?]]> <![CDATA[什么是全自动型控溅射?What is a fully automatic magnetron sputtering table?]]> <![CDATA[Classification of different processes in semiconductor manufacturing在半g刉业中,各种不同的工艺的分类]]> <![CDATA[{离子去胶机主要用于哪些斚wQWhat are the main uses of plasma degumming machine?]]> <![CDATA[On semiconductor equipment (1) -- source and status of domestic semiconductor equipment论半g讑֤Q一Q?--国内半导体设备来源及状况]]> <![CDATA[蚀L产业的全新时代A new era of etcher industry]]> <![CDATA[如何提高控溅射台的溅射效率QHow to improve sputtering efficiency of magnetron sputtering table?]]> <![CDATA[The sputtering process involves complex scattering process and multiple energy transfer processes溅射q程中涉及到复杂的散过E和多种能量传递过E]]> <![CDATA[{离子刻蚀工艺--装片Plasma etching process -- chip loading]]> <![CDATA[How to improve the utilization rate is the key point of vacuum magnetron sputtering coating industry如何提高利用率是真空控溅射镀膜行业的重点]]> <![CDATA[  The application of plasma etcher in PCB industry{离子刻蚀机在PCBU\板行业去胶渣制程的应用]]> <![CDATA[赛森电子带您了解高真I磁控溅台Cycas electronics show you the high vacuum magnetron sputtering table]]> <![CDATA[什么公怼用到{离子刻蚀机?What companies use plasma etchers?]]> <![CDATA[{离子技术在汽R工业的用Application of plasma technology in automobile industry]]> <![CDATA[控溅射台设备用途和功能特点Application and function of magnetron sputtering equipment]]> <![CDATA[你知道等d去胶机的原理QDo you know the principle of plasma degummer?]]> <![CDATA[{离子表面处理设备是怎样使用的?How is plasma surface treatment equipment used?]]> <![CDATA[赛森电子U技告诉你磁控溅的U类Cycas electronic technology tells you the type of magnetron sputtering]]> <![CDATA[湿法刻蚀相对于等d刻蚀的缺点Disadvantages of wet etching compared with plasma etching]]> <![CDATA[半导体设备硅刻蚀机概qOverview of silicon etcher for semiconductor equipment]]> <![CDATA[Chinas plasma etching machine has reached the advanced level in the world中国{离子体刻蚀C界先q水q]]> <![CDATA[控溅射的工作原理是什么?What is the working principle of magnetron sputtering?]]> <![CDATA[{离子刻蚀机的工作原理和注意事Working principle and precautions of plasma etcher]]> <![CDATA[q法去胶工艺原理及用?Principle and application of dry degumming process?]]> 国产日韩在线视看第一页